HDI, High Density Interconnect, with microvia≤0.15mm, use fine feature technology to connect components in small packages. HDI’s smaller geometry allows for higher wiring density. The electrical performance is greatly improved because of control on lower parasitic, minimal stubs, removal of decoupling capacitors and lower crosstalk. RFI and EMI is much lower due to ground planes being closer together, distributed capacitance is closer.

Kinwong capabilities are as follows:

  • Increasing the wiring density
  • Facilitates the use of advanced packaging technology
  • Can improve radio frequency interference / electromagnetic wave interference / electrostatic discharge (RFI/EMI/ESD)
  • Any-layer (2021, Zhuhai)
  • mSAP (2023, Zhuhai)
  • Advanced equipment
  • Min. trace width/spacing: 0.04mm/0.04mm (2021, Zhuhai)
  • Max. solder mask registration tolerance+/-1mil

For more information about Kinwong’s capabilities, please contact one of our Field Application Engineers